RESIN PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin package, by which the adhesive strength between a lead frame and resin can be increased while maintaining high conductivity on the surface of the lead frame. SOLUTION: The method of manufacturing the resin package 1 comprises steps of: oxidizing the surface of the lead frame 3 at least the surface of which is made of copper to form a copper oxide layer 20; and removing a predetermined region of the copper oxide layer 20 by acid solution after making the copper oxide layer 20 adhere to the surface of the lead frame 3 with the resin to mold a resin package body 11 by resin molding for package. COPYRIGHT: (C)2010,JPO&INPIT