| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which makes heat not to transmit easily to solder for joining the substrate of circuit and a conductive block, when the conductive block and a tab for external connection are welded, and to provide a method of producing a circuit board. SOLUTION: A conductive block 15, provided with a conductive block solder receiving portion 15b for preventing molten solder from scattering to the outside, and a conductive block protrusion 15a for connection with a conductive through-hole 12 as the electrode portion of the substrate 11 of circuit, is electrically and mechanically bonded to the substrate 11 of circuit provided with the conductive through-hole 12. COPYRIGHT: (C)2010,JPO&INPIT |
