| 摘要 |
PURPOSE: A manufacturing method of a probe assembly having an drive IC is provided to remove the necessary of a COG(Chip On Glass) by directly bonding a drive IC to a beam part. CONSTITUTION: In a manufacturing method of a probe assembly having an drive IC, a base substrate is formed on a beam portion(4). A polyimide film is adhered to a lower-part of the base substrate. Dicing is performed in vertically from the bottom of the base substrate by a certain height. The Base substrate is diced and is etched in width direction so that formed gap which is formed by dicing is extended, and the polyimide film is removed. The driving IC(100) is bonded at the other end of the beam portion.
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