| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sheet type structure, very high in the thermal conductivity and electric conductivity thereof, and its manufacturing method as well as a high performance electronic instrument employing such the sheet type structure, in reference to the sheet type structure employed for the purpose of heat dissipation or electric conduction. <P>SOLUTION: The sheet type structure comprises a plurality of linear structures 12 of carbon element, a filling layer 16, filled into gaps between the linear structures 12 to retain the plurality of linear structures 12, and a coating film 14, formed at least one side of the terminal part of the plurality of linear structures 12 and provided with a thermal conductivity of not less than 0.1 W/(m K). <P>COPYRIGHT: (C)2010,JPO&INPIT |
