CALIBRATION OF NON-VIBRATING CONTACT POTENTIAL DIFFERENCE MEASUREMENTS TO DETECT SURFACE VARIATIONS THAT ARE PERPENDICULAR TO THE DIRECTION OF SENSOR MOTION

摘要

A method and system for determining the contact potential difference of a wafer surface using a non-vibrating contact potential difference probe and a vibrating contact potential difference probe. The method and system involves scanning the wafer surface with a non-vibrating contact potential difference sensor, integrating and scaling the resulting data, and applying offsets to individual tracks of data to match the integrated scaled data to measurements made using a vibrating contact potential difference sensor.