发明名称 CONTACT FOR ELECTRICAL TEST OF ELECTRONIC DEVICES, METHOD FOR MANUFACTURING THE SAME, AND PROBE ASSEMBLY
摘要 PURPOSE: A contact for electrically testing an electronic device, a probe assembly and a manufacturing method thereof are provided to prevent misalignment of the adjacent contact by bonding the contact with the substrate using the light with low heat energy. CONSTITUTION: A first area(24) is bonded in a substrate. A second area(26) is extended from the first area to left and right direction and is elastically changed. A third area has a needle line in contact with an electrode of a semiconductor device. A low light reflective film(40) is formed on at least part of the bonding part of the substrate in the first area. The light reflective film is made of the material with the reflectivity lower than the reflectivity of the visible rays of the first area. A contact(16) includes the substrate bonded in the first area.
申请公布号 KR20090115666(A) 申请公布日期 2009.11.05
申请号 KR20090034848 申请日期 2009.04.22
申请人 KABUSHIKI KAISHA NIHON MICRONICS 发明人 KAMATA SHOJI;SATO TOMOYA;TAKEYA TOSHINAGA;HAYASHIZAKI TAKAYUKI
分类号 H01L21/66;G01R1/067 主分类号 H01L21/66
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