发明名称 |
Rectangular-Shaped Controlled Collapse Chip Connection |
摘要 |
A rectangular-shaped controlled collapse chip connection (C4) is described. In one embodiment, there is a semiconductor chip package that comprises a semiconductor chip package substrate and a semiconductor chip having a plurality of rectangular-shaped C4 contacts attached thereto that connect the semiconductor chip to the semiconductor chip package substrate. The plurality of rectangular-shaped C4 contacts are arranged along a surface of the semiconductor chip in an orientation that extends radially from a center of the surface of the semiconductor chip.
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申请公布号 |
US2009273095(A1) |
申请公布日期 |
2009.11.05 |
申请号 |
US20080114867 |
申请日期 |
2008.05.05 |
申请人 |
AYOTTE STEPHEN P;HILL DAVID J;SULLIVAN TIMOTHY M |
发明人 |
AYOTTE STEPHEN P.;HILL DAVID J.;SULLIVAN TIMOTHY M. |
分类号 |
H01L23/52;H01L21/00 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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