| 摘要 |
PURPOSE: A susceptor, and a method and a device for manufacturing a semiconductor are provided to improve yield and productivity by forming a film by supplying the reactive gas to the surface while heating a wafer through the susceptor. CONSTITUTION: A first end is formed for installing a wafer. A susceptor(11) includes a convex part(12b) in a lower part of the first end. A gap is formed between a rear surface of the wafer and the top of the convex part. An inner susceptor(12) has the convex part on the surface and is smaller than the diameter of the wafer. The first end has an opening in the center. The inner susceptor is installed to close the opening. An outer susceptor(13) is installed in the upper part of the first end and has a second end for installing the wafer. |
