发明名称 |
METHOD OF FORMING CONDUCTIVE PATICLE |
摘要 |
PURPOSE: A method for forming conductive particles is provided to innovatively reduce a process number, to lower product costs, and to improve the generation of a contaminant. CONSTITUTION: A method for forming conductive particles comprises the steps of: preparing a catalyst solution by dissolving a catalyst compound; adding the polymer particles in the catalyst solution, and supporting the catalyst compound on the surface of the polymer particles by evaporating a solvent while stirring the added mixture; activating the catalyst compound; electroless plating an adhesive layer to the polymer particles in which a catalyst is dipped; and electroless plating a conductive layer on the adhesive layer.
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申请公布号 |
KR20090114813(A) |
申请公布日期 |
2009.11.04 |
申请号 |
KR20080040657 |
申请日期 |
2008.04.30 |
申请人 |
JEONGEUI IND CO., LTD. |
发明人 |
HONG, SUNG JEI;HAN, JEONG IN |
分类号 |
H01B1/02;B32B1/00;B32B27/00 |
主分类号 |
H01B1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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