发明名称 METHOD OF FORMING CONDUCTIVE PATICLE
摘要 PURPOSE: A method for forming conductive particles is provided to innovatively reduce a process number, to lower product costs, and to improve the generation of a contaminant. CONSTITUTION: A method for forming conductive particles comprises the steps of: preparing a catalyst solution by dissolving a catalyst compound; adding the polymer particles in the catalyst solution, and supporting the catalyst compound on the surface of the polymer particles by evaporating a solvent while stirring the added mixture; activating the catalyst compound; electroless plating an adhesive layer to the polymer particles in which a catalyst is dipped; and electroless plating a conductive layer on the adhesive layer.
申请公布号 KR20090114813(A) 申请公布日期 2009.11.04
申请号 KR20080040657 申请日期 2008.04.30
申请人 JEONGEUI IND CO., LTD. 发明人 HONG, SUNG JEI;HAN, JEONG IN
分类号 H01B1/02;B32B1/00;B32B27/00 主分类号 H01B1/02
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