| 摘要 |
<p>Activator, which is a substituted imidazole compound (I) or reaction product of a 2-phenyl-4,5-dihydro-1H-imidazole compound (Ia) with an isocyanate or epoxide, is new. Activator, which is a substituted imidazole compound of formula (I) or reaction product of a 2-phenyl-4,5-dihydro-1H-imidazole compound of formula (Ia) with an isocyanate or epoxide, is new. R 1> : n-valent, optionally heteroatom containing, aliphatic, cycloaliphatic or aromatic organic residue, or (-[(CH 2) i-[CH(CH 3)] j-X] k-[CH 2] i-[CH(CH 3)] j-Y 1>); X : O, S or NR 7>; Y 1> : OR 7>, SR 7>, N(R 7>)(R7a) or benzamide group of formula (III); either R2a, R3a, R 2>, R 3> : H, OH, halo, NH 2, NHR 7>, N(R 7>) 2, alkoxy, alkyl, aryl or alkylaryl; or R2aR3a, R 2>R 3> : aliphatic or aromatic ring (optionally substituted); R 7>, R7a : H, 1-8C alkyl, 1-8C cycloalkyl, 1-8C aralkyl or 1-8C aryl; either R 4>, R 5> : H, OH, halo, alkoxy, alkyl, aryl or alkylaryl; or R 5>R 5> : aliphatic or aromatic ring (optionally substituted); n : 1-4; and i, j, k : 0-10, with proviso that the sum of i and j is at least 2. Provided that: at least one of R 2>-R 5>is different from H, if R2a and/or R3a are present; and at least three of R 2>, R2a, R 3>and R3a are different from H. Independent claims are included for: (1) a heat-curable epoxide resin composition comprising at least one epoxide resin A with an average of greater than one epoxide group per molecule; at least one hardener B for an epoxide resin, which is activated at elevated temperature; and at least one activator; and (2) a method for adhering heat-stable substrate comprising applying the composition on the surface of substrate; contacting the applied composition with the surface of a further heat-stable substrate; and heating the composition to 100-220[deg] C, preferably 160-190[deg] C, where the substrate is preferably a metal. [Image] [Image].</p> |
