| 摘要 |
PURPOSE: An electroless gold plating bath and a method for plating gold using the same are provided to produce a gold plating layer that exhibits high adhesion property of non-metals. CONSTITUTION: An electroless gold plating bath comprises aqueous Au compounds, organic phosphonic acid containing a plurality of phosphonic acid groups or its salt as a coloring agent, and their salts. The electroless gold plating bath additionally contains polyethyleneimine compounds. The average molecular weight of polyethyleneimine compound is 300 ~ 100,000. The content of the polyethyleneimine compounds is 0.01 ~ 100 g/?“. The content of the coloring agent is 0.005 ~ 0.5 mol/?“. The electroless gold plating bath contains one selected from the group consisting of pH stabilizer, brightener, moisturizing agent, and reducing agent. |
