METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing the semiconductor device is provided to increase the junction area of the wiring board by connecting the connection terminal of the interposer to the semiconductor device. CONSTITUTION: The semiconductor device(102) is formed on the substrate(101). The conductive films(106,107) are formed on the side surface of a member. The semiconductor device is adhered to the member in which the conductive film is formed by the adhesive(108). The electrode of the semiconductor device is electrically connected to the conductive film. The adhesive is the anisotropy conductive element. The adhesive includes conductive particles.