发明名称 Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions
摘要 The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.
申请公布号 US7611982(B2) 申请公布日期 2009.11.03
申请号 US20050553517 申请日期 2005.10.14
申请人 TDK CORPORATION 发明人 YOSHIDA MASAYUKI;AOKI SHUNJI;SUTOH JUNICHI;WATANABE GENICHI
分类号 H01F41/04;H01L21/4763;H01F17/00;H05K1/03;H05K1/16;H05K3/46 主分类号 H01F41/04
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