METAL FRAME FOR ELECTRONIC PART

摘要

PURPOSE: A metal frame for electronic part is provided to supply a metal frame for electric part by forming a Sn based metal layer at one side of the metal frame. CONSTITUTION: The lead portion(15) is electrically connected to the electric component. The lead portion includes the main component of copper(Cu). The semiconductor chip(12) is settled in the die pad(11). The semiconductor chip and inner lead(13) are bonded by the wire(16) and is molded by the resin protecting material(17). The first metal layer includes boron(B) or beryllium(Be). The first metal layer is formed in the lead portion.