Method to control uniformity/composition of metal electrodes, silicides on topography and devices using this method

摘要

A method for depositing metals on surfaces is provided which comprises (a) providing a substrate (103) having a horizontal surface (107) and a vertical surface (105); (b) depositing a first metal layer (109) over the horizontal and vertical surfaces; (c) depositing a layer of polysilicon (111) over the horizontal and vertical surfaces; (d) treating the layer of polysilicon with a plasma such that a residue (113) remaining from the treatment is preferentially formed over the horizontal surfaces rather than the vertical surfaces, and wherein the residue is resistant to a first metal etch; and (e) exposing the substrate to the first metal etch.