发明名称 Pattern forming method, computer program thereof, and semiconductor device manufacturing method using the computer program
摘要 A pattern of a desired size is formed on a semiconductor substrate by the following procedure. A property, including at least one of an aberration of an exposure device, a property of an illumination, a property of a projection lens, and a pattern coverage in a shot, are allocated, in a first database, to predetermined positions assigned in a chip. A second database is prepared by pairing a cell name of a cell extracted from hierarchical processing of a design pattern and arrangement positional data of the cell. The property data is allocated to the cell based on the first and second databases. Mask data processing based on at least one of the property data is executed, and the cell subjected to the mask data processing is rearranged on the chip.
申请公布号 US7614026(B2) 申请公布日期 2009.11.03
申请号 US20060521440 申请日期 2006.09.15
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KOTANI TOSHIYA;ICHIKAWA HIROTAKA
分类号 G06F17/50;G03F1/36;G03F1/68;G03F1/70 主分类号 G06F17/50
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