| 发明名称 |
Electroless copper compositions |
| 摘要 |
Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.
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| 申请公布号 |
US7611569(B2) |
申请公布日期 |
2009.11.03 |
| 申请号 |
US20070825379 |
申请日期 |
2007.07.06 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
POOLE MARK A.;COBLEY ANDREW J.;SINGH AMRIK;HIRST DEBORAH V. |
| 分类号 |
C23C18/40;B05D5/12;H05K3/18 |
主分类号 |
C23C18/40 |
| 代理机构 |
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