PURPOSE: A stack package is provided to improve the degree of freedom of the stacked package structure by forming the stacked package having semiconductor chips of staircase type. CONSTITUTION: A plurality of the connection pad(112) is formed on the substrate(110). A plurality of the semiconductor chip(120) has a bonding pad(122) on the substrate to expose the bonding pad. The metal wire(130) connects the bonding pad of semiconductor chips and the connection pad. The dummy pad(124) is adhered to the metal wire. The dummy pad is electrically broken down from the semiconductor chip. The dummy pad is formed in the semiconductor chips.
