| 摘要 |
PURPOSE: An apparatus for separating a semiconductor chip is provided to reduce an installation space by operating a support pin with a linear driving force and making a device simple. CONSTITUTION: In an apparatus for separating a semiconductor chip, a grip portion holds an adhesive sheet to which a plurality of semiconductor chips are attached. A transfer unit horizontally moves the grip portion. A separation unit(130) separates one of semiconductor chips selected by the grip portion from the adhesive sheet. The separation unit includes a plurality of support pins(131), a pin holder(132), an actuator(133) and a rod(134). A plurality of support pins pushes up the semiconductor chips directly, and the actuator generates a driving force according to an input current by using a voice coil.
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