| 摘要 |
PURPOSE: An in-line sawing system for a semiconductor production is provided to allow a pull-cutting to be performed consecutively after a chamfer-cutting by arranging the pull-cutting and the chamfer-cutting in line. CONSTITUTION: An in-line sawing system is composed of a pull-cutting apparatus(11) and a chamfer-cutting apparatus(10) which are in-line. The pull-cutting apparatus and the chamfer-cutting apparatus includes a region in a chuck table is included and a region in which a spindle is included. The spindle is a blade(17) for the pull-cutting and a blade(16) for the chamfer cutting, and spindle mounted in the chamfer cutting is an end mill of chamfer cutting. The pull-cutting apparatus and the chamfer-cutting apparatus have a dual type spindle.
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