| 摘要 |
A method for manufacturing a semiconductor package is provided to prevent the warpage of an LGA(Land Grid Array) package having a thin thickness by fabricating a preliminary semiconductor package and performing a thermal treatment thereon. Plural bonding pads(12) are arranged on a first surface(10a) of a base substrate(10). An external connection terminal(20) connected to the bonding pads are formed on a second surface opposite to the first surface of the base substrate. A semiconductor chip(100) where plural bumps(104) are arranged is attached to the first surface of the base substrate. Bumps of the semiconductor chip and the bonding pads of the base substrate are wire-bonded by a conductive wire(110). The semiconductor chip and the conductive wire are molded by a sealing resin to form a preliminary semiconductor package. A thermal treatment process is performed on the preliminary semiconductor package to prevent the warpage thereof. |
