| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a device for pattern correction, with which electrical resistance of a section to be corrected is made lower by forming a correcting layer with uniform film thickness on a defective section of a broken pattern (wire), without repeating operations and with a simple process. <P>SOLUTION: The device for pattern correction is used, with which an alloy layer of a metal film of a transfer member and a metal film for wire forming is formed on their bonded interface and they are bonded to each other by making them irradiated with a laser beam, in a state in which the metal film composed of a low-melting point metal formed on one principal surface of the base member is made to be in intimate contact with the defective section of pattern (wire). Further, in a section lacking the metal film constituting the wire, the defective section of the wire is recovered by tightly bonding them via an interfacial reaction between the metal film on the transfer member and glass or silicon oxide exposed on the surface. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
