发明名称 ULTRASONIC MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an ultrasonic mounting device, wherein suitable bonding can be obtained for all the electrodes of mounting components, even when load on the mounting components is increased upon mounting. Ž<P>SOLUTION: A pushing shaft that adds load on the mounting components connected from a voice coil monitor is configured independently of a structure including a bonding tool, an ultrasonic horn, an oscillator and a horn support member, while the foregoing structure is arranged so as to move on the same axis as the drive adding axis of the pushing shaft. Furthermore, it is arranged such that the contact position between the bonding tool and the pushing shaft can match the so-called node of standing wave produced inside the bonding tool. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009253256(A) 申请公布日期 2009.10.29
申请号 JP20080103510 申请日期 2008.04.11
申请人 TDK CORP 发明人 SAITO YUJI;ASAKURA TOMOMI;MAKITA KOETSU;MIZUNO TORU;MIYAKOSHI TOSHINOBU
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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