| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyphenylene ether resin film which is excellent in heat resistance, toughness and thermal deformation characteristics, and a release film containing the same for manufacturing a printed circuit board. SOLUTION: The polyphenylene ether resin film is formed from a resin composition comprising a 50-85 mass% polyphenylene ether and 15-50 mass% block copolymer and/or a hydrogenated block copolymer comprising at least one polymer block essentially comprising an aromatic vinyl compound and at least one polymer block essentially comprising a conjugated diene compound. COPYRIGHT: (C)2010,JPO&INPIT
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