| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film formation method which can directly form a ceramic, metal or semi-metal film on the surface of a soft resin substrate using an AD (aerosol deposition) process. Ž<P>SOLUTION: Material particles are pulverized without giving damage to a substrate. As the first method, aerosols jetted from two or more many nozzles, respectively are collided each other, thus fine particles are pulverized, so as to form a film on the substrate. As the second method, aerosols are not directly jetted to the substrate but are jetted to a pulverization plate, so as to indirectly pulverize fine particles. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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