| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a wiring that not only prevents a plating film for forming the wiring of a base metal from being etched but also allows the thickness and width of the wiring to be the almost predetermined thickness and width (design thickness and width of the wiring) in a seed layer removing process for removing an unnecessary portion thereof, with respect to the method for forming the wiring mounted on an upper surface of the seed layer. Ž<P>SOLUTION: An exposed portion of the seed layer 12 is removed from a second resist film 19 after the second resist film 19 is formed so that a side surface 17B and upper surface 17A of the plating film 17 for forming the base metal of the wiring 10 are covered. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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