| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated substrate which has a proper thin film over the entire surface of the substrate, especially, even near a termination portion of laminating. SOLUTION: This method for manufacturing the laminated substrate having the thin film 31 on a second substrate 20 includes a process for forming an ion implantation layer 11, by implanting hydrogen ions or noble gas ions, or both, from the surface of a first substrate 10 which is a semiconductor substrate; a process for performing a surface-activating process, on at least one side surface of the ion-implanted surface 12 and a surface to be laminated 22 of the second substrate 20; a lamination process for laminating the first substrate 10 and the second substrate 20, by heating at least one of them when the ion-implanted surface 12 and the surface to be laminated 22 are laminated; and a peeling process for separating the first substrate 10 at the ion implantation layer 11 to make the first substrate thinner. COPYRIGHT: (C)2010,JPO&INPIT
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