发明名称 PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY
摘要 A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.
申请公布号 US2009265930(A1) 申请公布日期 2009.10.29
申请号 US20090504251 申请日期 2009.07.16
申请人 HARRIS CORPORATION 发明人 JANDZIO GREGORY M.;PEDERSEN ANDERS P.;RIEF GARY A.;WHYBREW WALTER M.
分类号 H01K3/10;H01Q3/26;H01Q21/00;H05K1/02;H05K1/09;H05K3/42;H05K7/06 主分类号 H01K3/10
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