发明名称 Contact for interconnect system in a test socket
摘要 The present invention generally relates to testing of IC devices, and more specifically to a contact (11) for a test socket (1) for interfacing pads/leads (21) of the IC devices (2) with a printed circuit board (3) of a test handler. The contact (11) comprises a contact body (12), a first arm (13) adapted for electronically engaging the pads/leads (21) and a second arm (14) adapted for electronically engaging the corresponding terminals (31) on the printed circuit board (3). The first engaging means (15) is provided with a sliding means for improved sliding action between the contact (11) and the pads/leads (21). The sliding means enable a single contact to be used for various IC devices and also protects the pads/leads (21) and contacts (11) of the test socket (1) from damage and extensive wear.
申请公布号 US2009267629(A1) 申请公布日期 2009.10.29
申请号 US20090386778 申请日期 2009.04.22
申请人 J. FOONG TECHNOLOGIES SDN. BHD. 发明人 FOONG WEI KUONG
分类号 G01R31/02;G01R1/067 主分类号 G01R31/02
代理机构 代理人
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