| 摘要 |
An encapsulant composition is provided, including at least one resin monomer, a filler and a photoinitiator, wherein the at least one resin monomer is selected from the group consisting of acrylic resin monomer, epoxy resin monomer, silicone resin monomer and compositions thereof, and the filler is of about 0.1~15 weight % of the encapsulant composition. A method for forming encapsulant materials is also provided. |
