| 摘要 |
Beam soldering involves using a beam of light emitted from a source to reflow adjoining pairs of solder pads on components being joined. In some scenarios, material between adjacent solder pads on at least one of the components is absorptive of a certain spectrum of light and, consequently, can be damaged by such spectrum of light. A beam soldering tool is configured with a filter through which the light from the light source travels to a plurality of adjoining pairs of solder pads. The filter filters out a certain spectrum of light which could otherwise be damaging to material between adjacent solder pads. |
