发明名称 PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed wiring board which is very easy to design and has superior signal quality (signal integrity) and electromagnetic compatibility (EMC). <P>SOLUTION: The printed wiring board includes strip-processed conductor layers 13, 15 and 19 for signal transmission, conductor layers 14 and 17 for a ground plane, a strip-processed conductor layer 18 for power distribution, substrates 25, 28, 30, 32, and 35 of insulators each having conductor foil stuck on one surface or both surfaces in advance, and prepreg layers 26, 29, 31, and 34 of semiconductors, and prepreg layers 27 and 33 of insulators, and an isolated electromagnetic wave concept is applied to circuit design. Consequently, very high signal integrity and electromagnetic wave environment adaptivity are obtained without using a terminating resistance nor an EMC countermeasure component. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009253125(A) 申请公布日期 2009.10.29
申请号 JP20080101039 申请日期 2008.04.09
申请人 I CAST:KK 发明人 TOYA HIROKAZU;TOOYA NORIHISA
分类号 H05K1/02;H01P1/22;H01P3/08;H05K3/46 主分类号 H05K1/02
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