| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for bonding semiconductor substrates together with high parallelism between them, and a manufacturing method of semiconductor devices using the apparatus. SOLUTION: The bonding apparatus 1 for bonding the semiconductor substrates Wu and Wd together includes a substrate holding table 24 which holds the semiconductor substrate Wu, a substrate holding table 36 which holds the semiconductor substrate Wd opposite to the semiconductor substrate Wu and moves to and away from the substrate holding table 24, and a driving mechanism 42 having a first actuator 60 tilting the substrate holding table 36, and the first actuator 60 has first bellows 61 which are annular, and expand and shrink to increase and decrease the distance between one end and the other end, a first top wall portion 62 airtightly closing the one end, a first bottom wall portion 63 airtightly closing the other end, a first introduction/discharging portion 64a which supplies and discharges a fluid into and from an airtight space 64b, and a first hydrostatic bearing 65 provided to the first top wall portion 62 to support the substrate holding table 36 without contacting. COPYRIGHT: (C)2010,JPO&INPIT |
