| 摘要 |
A semiconductor device includes a plurality of package terminals included in a package, a plurality of chips provided on the package, each of the chips including a memory cell array and a plurality of data input/output terminals, and a plurality of data line control switch disposed between the plurality of package terminals and the plurality of data input/output terminals. The plurality of data line control switches of each of the chips connects the data input/output terminals of each of the chips to corresponding ones of the plurality of package terminals in a normal mode. The plurality of data line control switches connects different groups of the data input/output terminals in different ones of the chips to respective groups of the package terminals in a test mode. The respective groups of the data input/output terminals belong to the plurality of data input/output terminals. The respective groups of the package terminals are different between different ones of the chips. |
