METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMICONDUCTOR MANUFACTURING

摘要

Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device includes a base having a first surface; a resin layer adhering to the first surface of the base; and a plurality of abrasive beads affixed to the first surface by the resin layer, the plurality of abrasive beads comprising a plurality of abrasive particles suspended in binder material; wherein the plurality of abrasive beads and the resin layer comprise an abrasive side of the polishing device adapted to contact the substrate. Numerous other aspects are provided.