| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroplating method which prevents the dissolution of a metal substrate and can normally electroplate even an extremely thin metal substrate, when electroplating the surface of the metal substrate. <P>SOLUTION: When electroplating the surface of the metal substrate, the electroplating method includes: employing an electroplating liquid which contains at least one of carbon dioxide and an inert gas, contains a surface active agent, and makes a metal powder with an average particle diameter larger than 100 μm in an amount exceeding the soluble amount of the metal powder added and dispersed therein; and electroplating the substrate in a supercritical state or a subcritical state. Then, the method can decrease a dissolution rate of the metal substrate because the metal exists in the electroplating liquid in a saturated or supersaturated state, and also prevents the occurrence of an induced co-deposition phenomenon to provide a smooth plated layer on the surface of the metal substrate in a short period of time. The electroplating method can be applied even to the case in which the metal substrate is a metallic thin film formed on the surface of an insulating layer provided on a substrate, and also even to the case in which the metal is copper, zinc, iron, nickel and cobalt. <P>COPYRIGHT: (C)2010,JPO&INPIT |
