| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in patterning ability, especially developability, heat-resistant flowability, and adhesion in development. <P>SOLUTION: The radiation-sensitive resin composition contains an alkali soluble resin (A), a photoacid generator (B), and an acid phosphoric compound (C). The radiation-sensitive resin composition may further contain a crosslinking agent. It is desirable that the acid phosphoric compound (C) is a compound having one or two hydroxyl groups. It is desirable that the acid phosphoric compound (C) has a phosphate ester structure. <P>COPYRIGHT: (C)2010,JPO&INPIT |
