发明名称 FIBER-REINFORCED RESIN CORE, AND METHOD FOR MOUNTING NON-CONTACT IC TAG TO FIBER-REINFORCED RESIN CORE
摘要 <P>PROBLEM TO BE SOLVED: To provide a fiber-reinforced resin core having an IC tag which is not broken easily; a method for mounting an IC tag to a fiber-reinforced resin core capable of mounting the IC tag so as not to be broken easily; and also a fiber-reinforced resin core with an IC tag, whose cylindrical base body is formed of a carbon fiber-reinforced resin, and which is capable of sufficiently reading and writing information of an IC chip. <P>SOLUTION: An IC tag 40 is embedded inside a fiber-reinforced resin layer constituting a cylindrical base body. Also, a surface layer is removed to expose the fiber-reinforced resin layer, and the IC tag is adhered to the surface of the exposed fiber-reinforced resin layer, so as to form the surface layer on the surface of the fiber-reinforced resin layer, to which the IC tag is adhered, again. Furthermore, the IC tag is spaced from the carbon fiber-reinforced resin layer constituting the cylindrical base body in a thickness direction of the IC tag. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009249123(A) 申请公布日期 2009.10.29
申请号 JP20080099885 申请日期 2008.04.08
申请人 TENRYU IND CO LTD;MITSUBISHI ELECTRIC CORP 发明人 SHINKAWA MASASHI;NISHIO TETSUYA;OKEGAWA HIROKATSU
分类号 B65H75/10;B65H75/18;G06K19/00;G06K19/07 主分类号 B65H75/10
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