发明名称 METHOD OF LASER ANNEALING OF SEMICONDUCTOR LAYER, AND SEMICONDUCTOR DEVICES PRODUCED THEREBY
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser annealing method which enables annealing of a semiconductor layer without causing variations in electrical or physical properties of a semiconductor layer, can improve the efficiency of fabrication, and enables manufacture of large-sized products, and to provide a semiconductor device which is produced by this method. <P>SOLUTION: This method includes forming a nitrogen-doped layer on a semiconductor layer (200), the nitrogen-doped layer having a nitrogen concentration of at least 3×10<SP>20</SP>atoms/cc, irradiating a first area of the nitrogen-doped layer in a low oxygen environment with a laser beam (202) and irradiating a second area of the nitrogen-doped layer in the low oxygen environment with the laser beam, a part of the second area overlapping with the first area (204). <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009253282(A) 申请公布日期 2009.10.29
申请号 JP20090074902 申请日期 2009.03.25
申请人 TOSHIBA MOBILE DISPLAY CO LTD 发明人 NAKAMURA ATSUSHI;KAMIMURA TAKAAKI;LIM KIAN KIAT;TAN KAI PHENG;LIM ENG SOON;FU PHO LING
分类号 H01L21/20;H01L21/265;H01L21/336;H01L29/786 主分类号 H01L21/20
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