| 摘要 |
In a semiconductor manufacturing method, a metal film is formed on a substrate and heat treated. The relationship between substrate warping and the heat treatment temperature during suicide formation is acquired (S1). A silicide film is formed by forming a metal film on a substrate and heat treating, including substrate measurement during heat treatment (S2). The relationship between substrate warping at heat treatment temperature is determined from the relationship between the warping of the substrate and the temperature for heat treatment and the temperature for heat treatment carried out on the substrate when the warping of the substrate is measured. The difference between found warping and the measured warping is calculated (S4). Whether the difference exceeds a predetermined value is determined (S5). If the difference exceeds a predetermined value, heat treatment conditions are adjusted (S8), but they not adjusted if the difference is no greater than the predetermined value.
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