| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad, along with a chemical mechanical polishing method using the same, which is excellent in polishing speed and in-surface uniformity in polishing amount on a polished surface, with less scratching and sliding resistance. <P>SOLUTION: The chemical mechanical polishing pad has such a polishing layer which contains (A) polyethylene by 5-95 pts.mass, (B) styrene-butadiene copolymer by 95-5 pts.mass and (C) water-soluble substance by 5-80 pts.volume against the total 100 pts.volume of (A) component and (B) component. <P>COPYRIGHT: (C)2010,JPO&INPIT |
