发明名称 FILM THICKNESS MEASUREMENT METHOD, FILM THICKNESS MEASUREMENT PROGRAM, FILM THICKNESS MEASUREMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a film thickness measurement method capable of high accurately measuring a film thickness of an object to be measured that is moving, such as a film being conveyed in a manufacturing step or the like. <P>SOLUTION: A film thickness measurement method for, by irradiating a surface of a thin film with light and obtaining a spectrum by splitting light reflected from the thin film, calculating a film thickness value of the thin film from the spectrum includes the steps of: (1) calculating a temporary film thickness value from the spectrum thus obtained; (2) preparing a refractive index wavelength dispersion formula model for the thin film for each of plural film thickness values selected from those close to the temporary value; (3) making a comparison between a refractive index of the thin film separately obtained at a predetermined wavelength and each refractive index calculated at the predetermined wavelength from the refractive index wavelength dispersion formula model prepared for each of the plural film thickness values; and (4) calculating a final film thickness value by evaluating a difference between the refractive indices compared in step (3). <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009250877(A) 申请公布日期 2009.10.29
申请号 JP20080101545 申请日期 2008.04.09
申请人 NITTO DENKO CORP 发明人 TAKADA YUKI
分类号 G01B11/06;G01N21/41;G02F1/13;G02F1/13363 主分类号 G01B11/06
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