| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus for reducing the number of wirings between substrates. Ž<P>SOLUTION: A solid-state image sensor 110 is disposed on a first substrate 100, and the first substrate 100 is movable in an arbitrary direction within a surface nearly vertical to the optical axis of an imaging optical system. A second substrate 200 is fixed in a case. When the first substrate 100 is moved to a predetermined position, the first substrate 100 and the second substrate 200 are electrically connected, and a still picture capturing signal is transmitted to the second substrate 200 by a contact terminal 302. Furthermore, a moving picture capturing signal is transmitted to the second substrate 200 via a flexible printed circuit board 301 connecting the first substrate 100 and the second substrate 200 at all times. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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