发明名称 SUBSTRATE TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To suppress the generation of a short circuit between electrode members, and further to suppress deterioration in a component caused by the action of a cleaning gas. Ž<P>SOLUTION: The substrate treatment device comprises: a treatment chamber treating a substrate; a heater provided at the inside of the treatment chamber and heating the substrate; a gas feed port feeding a gas into the treatment chamber; a supporting plate provided so as to cover the heater, composed of an insulator and supporting the substrate; an electrode part provided at the part lower than the rear face of the supporting plate and charging power to the heater; a power line connected to the electrode part and feeding power; and an isolating member isolating the electrode part and the source line from the atmosphere in the treatment chamber by covering the electrode part and the power line. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009249724(A) 申请公布日期 2009.10.29
申请号 JP20080102541 申请日期 2008.04.10
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NAKAGAWA HITOSHI
分类号 C23C16/44;H01L21/285;H01L21/3065 主分类号 C23C16/44
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