LEAD-FREE SOLDER ALLOY SUPPRESSED IN OCCURRENCE OF SHRINKAGE CAVITY

摘要

Disclosed is a lead-free solder alloy having improved surface properties, which is suppressed in occurrence of fine recesses/projections or shrinkage cavity. The lead-free solder alloy has a composition consisting of 0.1-1.5% of Ag, 2.5-5.0% of Bi, 0.5-1.0% of Cu, and if necessary 0.015-0.035% of Ni and/or 0.0005-0.01% of one or both of Ge and Ga, and the balance of Sn and unavoidable impurities.