| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable the recovery of an undamaged electronic device, such as a chip, from a defective interconnect structure or package. <P>SOLUTION: An electronic component includes: a base insulative layer 10 having a first surface and a second surface; an electronic device 18 having a first surface and a second surface; at least one I/O contact 23 located on the first surface of the electronic device; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; a first metal layer disposed on the I/O contact; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer, and located adjacent to the first metal layer. The base insulative layer 10 is fixed to the electronic device through the first metal layer and removable layer, wherein the first metal layer and removable layer are capable of releasing the base insulative layer from the electronic device when the first metal layer and removable layer are exposed to a temperature higher than their softening points or melting points. <P>COPYRIGHT: (C)2010,JPO&INPIT |
