发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent alkali developability and capable of forming a cured film excellent in flame retardancy, and to provide a photosensitive element using the same. <P>SOLUTION: The photosensitive resin composition comprises: (A) a novolac type acid-modified vinyl group-containing epoxy resin having a biphenyl skeleton, (B) an acrylic resin having a carboxylic acid, (C) a phosphorus-containing flame retardant, (D) a photopolymerizable compound having at least one ethylenically unsaturated group within a molecule, and (E) a photopolymerization initiator, wherein (B) the acrylic resin having a carboxylic acid has a weight average molecular weight of 50,000-150,000. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009251286(A) 申请公布日期 2009.10.29
申请号 JP20080099277 申请日期 2008.04.07
申请人 HITACHI CHEM CO LTD 发明人 ITAGAKI SHUICHI
分类号 G03F7/027;G03F7/004;G03F7/033;H05K3/28 主分类号 G03F7/027
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