| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which is free from degradation in moldability such as fluidity and curability, and colorability, and avoids short circuit trouble due to a conductive material even when used for a package in which the distance between pads or between wires is narrow, and to provide an electronic parts device equipped with an element sealed with the molding material. <P>SOLUTION: The epoxy resin molding material for sealing comprises an epoxy resin, a curing agent and melanin, wherein the melanin may be eumelanin. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
