ALIGNMENT METHOD, TIP POSITION DETECTING DEVICE AND PROBE APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an alignment method for simplifying a process of detecting a height of a plurality of probes, highly accurately detecting it in a short time and improving reliability of an inspection. SOLUTION: The alignment method includes: a process of detecting tip positions of the plurality of probes 12A by using the tip position detecting device 16 when aligning a semiconductor wafer W and the plurality of probes 12A; a process of detecting the tip positions of the plurality of probes 12A detected by the tip position detecting device 16, by using a lower CCD camera 13B; a process of transferring needle marks of the plurality of probes 12A onto a soft member 162D mounted on the tip position detecting device 16; a process of detecting the needle marks 162F of the plurality of probes on the soft member 162D by using an upper CCD camera 13A; and the process of detecting the electrode pad of the semiconductor wafer W by using the upper CCD camera 13A. COPYRIGHT: (C)2010,JPO&INPIT