发明名称 METHOD OF MANUFACTURING METAL FILM PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal film pattern which improves the sintering property of the metal film pattern consisting of a metal film formed on a substrate by sintering through the application of dispersed body of micro particles of metal onto the substrate and the heat treatment of the same and further improves the adhesiveness between the metal film pattern and the substrate. Ž<P>SOLUTION: The method is constituted of a step for applying the dispersed body of micro particles of metal on the surface of the substrate, a step for forming the precursor of the metal film by drying the dispersed body of micro particles of metal, a step for forming a metal film deposition region by irradiating energy line against the precursor of metal film, a step for conducting further metal film deposition to the precursor of the metal film in the vicinity of the metal film deposition region through heating by an induction heating method, and a step for removing the precursor of the metal film. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009252937(A) 申请公布日期 2009.10.29
申请号 JP20080097942 申请日期 2008.04.04
申请人 PANASONIC CORP 发明人 NOTOHARA YASUHIRO;MIYANISHI SATORU;YATSUNAMI RYUICHI
分类号 H01L21/288;H01J9/02;H01J11/02;H01J11/22;H01J11/34;H01L21/3205;H01L21/768 主分类号 H01L21/288
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